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* other brands and names are the property of their respective owners. information in this document is provided in connection with intel products. intel assumes no liability whatsoever, including infringement of any patent or copyright, for sale and use of intel products except as provided in intel's terms and conditions of sale for such products. intel retains the right to make changes to these specifications at any time, without notice. microcomputer products may have minor variations to this specification known as errata. april 1996 copyright ? intel corporation, 1996 order number: 272322-004 8xc51fx chmos single-chip 8-bit microcontrollers commercial/express 87c51fa/83c51fa/80C51FA/87c51fb/83c51fb/87c51fc/83c51fc * see table 1 for proliferation options y high performance chmos eprom/rom/cpu y 12/24/33 mhz operation y three 16-bit timer/counters y programmable counter array with: e high speed output, e compare/capture, e pulse width modulator, e watchdog timer capabilities y up/down timer/counter y three level program lock system y 8k/16k/32k on-chip program memory y 256 bytes of on-chip data ram y improved quick pulse programming algorithm y boolean processor y 32 programmable i/o lines y 7 interrupt sources y four level interrupt priority y programmable serial channel with: e framing error detection e automatic address recognition y ttl compatible logic levels y 64k external program memory space y 64k external data memory space y mcs 51 controller compatible instruction set y power saving idle and power down modes y once (on-circuit emulation) mode y extended temperature range except for 33 mhz offering ( b 40 cto a 85 c) memory organization device rom version eprom romless version rom/ bytes ram eprom bytes 83c51fa 87c51fa 80C51FA 8k 256 83c51fb 87c51fb 80C51FA 16k 256 83c51fc 87c51fc 80C51FA 32k 256 these devices can address up to 64 kbytes of external program/data memory. the intel 87c51fa/8xc51fb/8xc51fc is a single-chip control oriented microcontroller which is fabricated on intel's reliable chmos iii-e technology. the intel 83c51fa/80C51FA is fabricated on chmos iii technology. being a member of the mcs 51 controller family, the 8xc51fa/8xc51fb/8xc51fc uses the same powerful instruction set, has the same architecture, and is pin-for-pin compatible with the existing mcs 51 controller products. the 8xc51fa/8xc51fb/8xc51fc is an enhanced version of the 8xc52/8xc54/8xc58. its added features make it an even more powerful microcontroller for applications that require pulse width modulation, high speed i/o and up/down counting capabilities such as motor control. for the remainder of this document, the 8xc51fa, 8xc51fb, 8xc51fc will be referred to as the 8xc51fx, unless information applies to a specific device.
8xc51fx table 1. proliferation options standard * 1 -1 -2 -24 -33 80C51FA x x x x x 83c51fa x x x x x 87c51fa x x x x x 83c51fb x x x x x 87c51fb x x x x x 83c51fc x x x x x 87c51fc x x x x x notes: * 1 3.5 mhz to 12 mhz; 5v g 20% -1 3.5 mhz to 16 mhz; 5v g 20% -2 0.5 mhz to 12 mhz; 5v g 20% -24 3.5 mhz to 24 mhz; 5v g 20% -33 3.5 mhz to 33 mhz; 5v g 10% 272322 1 figure 1. 8xc51fx block diagram 2
8xc51fx processinformation the87c51fa/8xc51fb/8xc51fcismanufactured onp629.0,achmosiii-eprocess.additionalpro- cessandreliabilityinformationisavailableinthe intel ? quality system handbook: http://developer.intel.com/design/quality/quality.htm packages part prefix package type 8xc51fx p 40-pin plastic dip d 40-pin cerdip n 44-pin plcc s 44-pin qfp 272322 2 dip 272322 23 plcc 272322 24 * do not connect reserved pins. qfp figure 2. pin connections 3
8xc51fx pin descriptions v cc : supply voltage. v ss : circuit ground. v ss1 : secondary ground (not on dip devices or any 83c51fa/80C51FA device). provided to reduce ground bounce and improve power supply by-pass- ing. note: this pin is not a substitution for the v ss pin. (con- nection not necessary for proper operation.) port 0: port 0 is an 8-bit, open drain, bidirectional i/o port. as an output port each pin can sink several ls ttl inputs. port 0 pins that have 1's written to them float, and in that state can be used as high-im- pedance inputs. port 0 is also the multiplexed low-order address and data bus during accesses to external program and data memory. in this application it uses strong inter- nal pullups when emitting 1's, and can source and sink several ls ttl inputs. port 0 also receives the code bytes during eprom programming, and outputs the code bytes during program verification. external pullup resistors are re- quired during program verification. port 1: port 1 is an 8-bit bidirectional i/o port with internal pullups. the port 1 output buffers can drive ls ttl inputs. port 1 pins that have 1's written to them are pulled high by the internal pullups, and in that state can be used as inputs. as inputs, port 1 pins that are externally pulled low will source current (i il , on the data sheet) because of the internal pull- ups. in addition, port 1 serves the functions of the follow- ing special features of the 8xc51fx: port pin alternate function p1.0 t2 (external count input to timer/ counter 2), clock out p1.1 t2ex (timer/counter 2 capture/ reload trigger and direction control) p1.2 eci (external count input to the pca) p1.3 cex0 (external i/o for compare/ capture module 0) p1.4 cex1 (external i/o for compare/ capture module 1) p1.5 cex2 (external i/o for compare/ capture module 2) p1.6 cex3 (external i/o for compare/ capture module 3) p1.7 cex4 (external i/o for compare/ capture module 4) port 1 receives the low-order address bytes during eprom programming and verifying. port 2: port 2 is an 8-bit bidirectional i/o port with internal pullups. the port 2 output buffers can drive ls ttl inputs. port 2 pins that have 1's written to them are pulled high by the internal pullups, and in that state can be used as inputs. as inputs, port 2 pins that are externally pulled low will source current (i il , on the data sheet) because of the internal pull- ups. port 2 emits the high-order address byte during fetches from external program memory and during accesses to external data memory that use 16-bit addresses (movx @ dptr). in this application it uses strong internal pullups when emitting 1's. dur- ing accesses to external data memory that use 8-bit addresses (movx @ ri), port 2 emits the contents of the p2 special function register. some port 2 pins receive the high-order address bits during eprom programming and program verifica- tion. port 3: port 3 is an 8-bit bidirectional i/o port with internal pullups. the port 3 output buffers can drive ls ttl inputs. port 3 pins that have 1's written to them are pulled high by the internal pullups, and in that state can be used as inputs. as inputs, port 3 pins that are externally pulled low will source current (i il , on the data sheet) because of the pullups. 4
8xc51fx port 3 also serves the functions of various special features of the mcs-51 family, as listed below: port pin alternate function p3.0 rxd (serial input port) p3.1 txd (serial output port) p3.2 int0 (external interrupt 0) p3.3 int1 (external interrupt 1) p3.4 t0 (timer 0 external input) p3.5 t1 (timer 1 external input) p3.6 wr (external data memory write strobe) p3.7 rd (external data memory read strobe) rst: reset input. a high on this pin for two machine cycles while the oscillator is running resets the de- vice. the port pins will be driven to their reset condi- tion when a minimum v ih1 voltage is applied wheth- er the oscillator is running or not. an internal pull- down resistor permits a power-on reset with only a capacitor connected to v cc . ale: address latch enable output pulse for latching the low byte of the address during accesses to ex- ternal memory. this pin (ale/prog ) is also the program pulse input during eprom programming for the 87c51fx. in normal operation ale is emitted at a constant rate of (/6 the oscillator frequency, and may be used for external timing or clocking purposes. note, how- ever, that one ale pulse is skipped during each ac- cess to external data memory. if desired, ale operation can be disabled by setting bit 0 of sfr location 8eh. with this bit set, the pin is weakly pulled high. however, the ale disable fea- ture will be suspended during a movx or movc in- struction, idle mode, power down mode and ice mode. the ale disable feature will be terminated by reset. when the ale disable feature is suspended or terminated, the ale pin will no longer be pulled up weakly. setting the ale-disable bit has no affect if the microcontroller is in external execution mode. throughout the remainder of this data sheet, ale will refer to the signal coming out of the ale/prog pin, and the pin will be referred to as the ale/prog pin. psen : program store enable is the read strobe to external program memory. when the 8xc51fx is executing code from external program memory, psen is activated twice each ma- chine cycle, except that two psen activations are skipped during each access to external data memo- ry. ea /v pp : external access enable. ea must be strapped to vss in order to enable the device to fetch code from external program memory locations 0000h to 0fffh. note, however, that if either of the program lock bits are programmed, ea will be inter- nally latched on reset. ea should be strapped to v cc for internal program executions. this pin also receives the programming supply volt- age (v pp ) during eprom programming. xtal1: input to the inverting oscillator amplifier. xtal2: output from the inverting oscillator amplifi- er. oscillator characteristics xtal1 and xtal2 are the input and output, respec- tively, of a inverting amplifier which can be config- ured for use as an on-chip oscillator, as shown in figure 3. either a quartz crystal or ceramic resonator may be used. more detailed information concerning the use of the on-chip oscillator is available in appli- cation note ap-155, ``oscillators for microcontrol- lers.'' to drive the device from an external clock source, xtal1 should be driven, while xtal2 floats, as shown in figure 4. there are no requirements on the duty cycle of the external clock signal, since the in- put to the internal clocking circuitry is through a divide-by-two flip-flop, but minimum and maximum high and low times specified on the data sheet must be observed. an external oscillator may encounter as much as a 100 pf load at xtal1 when it starts up. this is due to interaction between the amplifier and its feedback capacitance. once the external signal meets the v il and v ih specifications the capacitance will not ex- ceed 20 pf. 5
8xc51fx 272322 3 c1, c2 e 30 pf g 10 pf for crystals for ceramic resonators, contact resonator manufacturer. figure 3. oscillator connections 272322 4 figure 4. external clock drive configuration idle mode the user's software can invoke the idle mode. when the microcontroller is in this mode, power consump- tion is reduced. the special function registers and the onboard ram retain their values during idle, but the processor stops executing instructions. idle mode will be exited if the chip is reset or if an en- abled interrupt occurs. the pca timer/counter can optionally be left running or paused during idle mode. power down mode to save even more power, a power down mode can be invoked by software. in this mode, the oscillator is stopped and the instruction that invoked power down is the last instruction executed. the on-chip ram and special function registers retain their val- ues until the power down mode is terminated. on the 8xc51fx either hardware reset or external interrupt can cause an exit from power down. reset redefines all the sfrs but does not change the on- chip ram. an external interrupt allows both the sfrs and the on-chip ram to retain their values. to properly terminate power down the reset or ex- ternal interrupt should not be executed before v cc is restored to its normal operating level and must be held active long enough for the oscillator to restart and stabilize (normally less than 10 ms). with an external interrupt, int0 or int1 must be en- abled and configured as level-sensitive. holding the pin low restarts the oscillator but bringing the pin back high completes the exit. once the interrupt is serviced, the next instruction to be executed after reti will be the one following the instruction that put the device into power down. design consideration # ambient light is known to affect the internal ram contents during operation. if the 87c51fx appli- cation requires the part to be run under ambient lighting, an opaque label should be placed over the window to exclude light. # when the idle mode is terminated by a hardware reset, the device normally resumes program exe- cution, from where it left off, up to two machine cycles before the internal reset algorithm takes control. on-chip hardware inhibits access to inter- nal ram in this event, but access to the port pins is not inhibited. to eliminate the possibility of an unexpected write when idle is terminated by re- set, the instruction following the one that invokes idle should not be one that writes to a port pin or to external memory. table 2. status of the external pins during idle and power down mode program ale psen port0 port1 port2 port3 memory idle internal 1 1 data data data data idle external 1 1 float data address data power down internal 0 0 data data data data power down external 0 0 float data data data note: for more detailed information on the reduced power modes refer to current embedded microcontrollers and processors handbook volume i, and application note ap-252 (embedded applications handbook), ``designing with the 80c51bh.'' 6
8xc51fx once mode the once (``on-circuit emulation'') mode facilitates testing and debugging of systems using the 8xc51fx without the 8xc51fx having to be re- moved from the circuit. the once mode is invoked by: 1) pull ale low while the device is in reset and psen is high; 2) hold ale low as rst is deactivated. while the device is in once mode, the port 0 pins float, and the other port pins and ale and psen are weakly pulled high. the oscillator circuit remains ac- tive. while the 8xc51fx is in this mode, an emulator or test cpu can be used to drive the circuit. normal operation is restored when a normal reset is applied. 8xc51fx express the intel express system offers enhancements to the operational specifications of the mcs-51 family of microcontrollers. these express products are designed to meet the needs of those applications whose operating requirements exceed commercial standards. the express program includes the commercial standard temperature range with burn-in and an ex- tended temperature range with or without burn-in. with the commercial standard temperature range, operational characteristics are guaranteed over the temperature range of 0 cto70 c. with the extend- ed temperature range option, operational character- istics are guaranteed over the range of b 40 cto a 85 c. the optional burn-in is dynamic for a minimum time of 168 hours at 125 c with v cc e 6.9v g 0.25v, following guidelines in mll-std-883, method 1015. package types and express versions are identified by a one- or two-letter prefix to the part number. the prefixes are listed in table 3. for the extended temperature range option, this data sheet specifies the parameters which deviate from their commercial temperature range limits. note: intel offers express temperature specifica- tions for all 8xc51fx speed options except for 33 mhz. table 3. prefix identification prefix package type temperature range burn-in d cerdip commercial no n plcc commercial no p plastic commercial no s qfp commercial no ld cerdip extended yes ln plcc extended yes lp plastic extended yes ls qfp extended yes td cerdip extended no tn plcc extended no tp plastic extended no ts qfp extended no note: contact distributor or local sales office to match express prefix with proper device. examples: p87c51fc indicates 87c51fc in a plastic package and specified for commercial temperature range, without burn-in. ld87c51fc indicates 87c51fc in a cerdip package and specified for extended temperature range with burn-in. 7
8xc51fx absolute maximum ratings * ambient temperature under bias b 40 cto a 85 c storage temperature b 65 cto a 150 c voltage on ea/v pp pin to v ss 0v to a 13.0v voltage on any other pin to v ss b 0.5v to a 6.5v i ol per i/o pin 15 ma power dissipation1.5w (based on package heat transfer limitations, not device power consumption) notice: this data sheet contains preliminary infor- mation on new products in production. it is valid for the devices indicated in the revision history. the specifications are subject to change without notice. * warning: stressing the device beyond the ``absolute maximum ratings'' may cause permanent damage. these are stress ratings only. operation beyond the ``operating conditions'' is not recommended and ex- tended exposure beyond the ``operating conditions'' may affect device reliability. operating conditions symbol description min max units t a ambient temperature under bias commercial 0 a 70 c express b 40 a 85 v cc supply voltage 8xc51fx-33 4.5 5.5 v all others 4.0 6.0 f osc oscillator frequency 8xc51fx 3.5 12 8xc51fx-1 3.5 16 mhz 8xc51fx-2 0.5 12 8xc51fx-24 3.5 24 8xc51fx-33 3.5 33 dc characteristics (over operating conditions) all parameter values apply to all devices unless otherwise indicated. symbol parameter min typical max units test conditions (note 4) v il input low voltage b 0.5 0.2 v cc b 0.1 v v il1 input low voltage ea 0 0.2 v cc b 0.3 v v ih input high voltage 0.2 v cc a 0.9 v cc a 0.5 v (except xtal1, rst) v ih1 input high voltage 0.7 v cc v cc a 0.5 v (xtal1, rst) v ol output low voltage (note 5) 0.3 i ol e 100 m a (ports 1, 2 and 3) 0.45 v i ol e 1.6 ma (note 1) 1.0 i ol e 3.5 ma v ol1 output low voltage (note 5) 0.3 i ol e 200 m a (port 0, ale/prog , psen ) 0.45 v i ol e 3.2 ma (note 1) 1.0 i ol e 7.0 ma v oh output high voltage v cc b 0.3 i oh eb 10 m a (ports 1, 2 and 3 v cc b 0.7 v i oh eb 30 m a (note 2) ale/prog and psen )v cc b 1.5 i oh eb 60 m a v oh1 output high voltage v cc b 0.3 i oh eb 200 m a (port 0 in external bus mode) v cc b 0.7 v i oh eb 3.2 ma (note 2) v cc b 1.5 i oh eb 7.0 ma 83c51fa/80C51FA (express) i oh eb 6.0 ma i il logical 0 input current b 50 m av in e 0.45v (ports 1, 2 and 3) 8
8xc51fx dc characteristics (over operating conditions) all parameter values apply to all devices unless otherwise indicated. (continued) symbol parameter min typical max units test conditions (note 4) i li input leakage current (port 0) g 10 m av in e v il or v ih i tl logical 1 to 0 transition current v in e 2v (ports 1, 2 and 3) express b 750 m a commercial b 650 rrst rst pulldown resistor 40 225 k x cio pin capacitance 10 pf @ 1mhz, 25 c i cc power supply current: (note 3) active mode at 12 mhz (figure 5) 15 30 ma at 16 mhz 20 38 ma at 24 mhz 28 56 ma at 33 mhz 35 56 ma idle mode at 12 mhz (figure 5) 5 7.5 ma at 16 mhz 6 9.5 ma at 24 mhz 7 13.5 ma at 33 mhz 7 15 ma power down mode 5 75 m a notes: 1. capacitive loading on ports 0 and 2 may cause noise pulses above 0.4v to be superimposed on the v ol s of ale and ports 1, 2 and 3. the noise is due to external bus capacitance discharging into the port 0 and port 2 pins when these pins change from 1 to 0. in applications where capacitance loading exceeds 100 pf, the noise pulses on these signals may exceed 0.8v. it may be desirable to qualify ale or other signals with a schmitt trigger, or cmos-level input logic. 2. capacitive loading on ports 0 and 2 cause the v oh on ale and psen to drop below the 0.9 v cc specification when the address lines are stabilizing. 3. see figures 6 9 for test conditions. minimum v cc for power down is 2v. 4. typicals are based on limited number of samples, and are not guaranteed. the values listed are at room temperature and 5v. 5. under steady state (non-transient) conditions, i ol must be externally limited as follows: maximum i ol per port pin: 10 ma maximum i ol per 8-bit port - port 0: 26 ma ports 1, 2, and 3: 15 ma maximum total i ol for all output pins: 71 ma if i ol exceeds the test condition, v ol may exceed the related specification. pins are not guaranteed to sink current greater than the listed test conditions. 272322 5 note: i cc max at 33 mhz is at 5v g 10% v cc , while i cc max at 24 mhz and below is at 5v g 20% v cc . figure 5. 8xc51fa/fb/fc i cc vs frequency 9
8xc51fx 272322 6 all other pins disconnected tclch e tchcl e 5ns figure 6. i cc test condition, active mode 272322 7 all other pins disconnected tclch e tchcl e 5ns figure 7. i cc test condition idle mode 272322 8 all other pins disconnected figure 8. i cc test condition, power down mode. v cc e 2.0v to 6.0v. 272322 19 figure 9. clock signal waveform for i cc tests in active and idle modes. tclch e tchcl e 5 ns. 10
8xc51fx explanation of the ac symbols each timing symbol has 5 characters. the first char- acter is always a `t' (stands for time). the other characters, depending on their positions, stand for the name of a signal or the logical status of that signal. the following is a list of all the characters and what they stand for. a: address c: clock d: input data h: logic level high i: instruction (program memory contents) l: logic level low, or ale p: psen q: output data r: rd signal t: time v: valid w: wr signal x: no longer a valid logic level z: float for example, tavll e time from address valid to ale low tllpl e time from ale low to psen low ac characteristics (over operating conditions, load capacitance for port 0, ale/prog and psen e 100 pf, load capacitance for all other outputs e 80 pf) external memory characteristics all parameter values apply to all devices unless otherwise indicated. in this table, 8xc51fx refers to 8xc51fx, 8xc51fx-1 and 8xc51fx-2. symbol parameter oscillator units 12 mhz 24 mhz 33 mhz variable min max min max min max min max 1/tclcl oscillator frequency mhz 8xc51fx 3.5 12 8xc51fx-1 3.5 16 8xc51fx-2 0.5 12 8xc51fx-24 3.5 24 8xc51fx-33 3.5 33 tlhll ale pulse width 127 43 21 2tclcl b 40 ns tavll address valid to ale low 8xc51fx 43 tclcl b 40 ns 8xc51fx-24 12 tclcl b 30 ns 8xc51fx-33 5 tclcl b 25 ns tllax address hold after ale low 8xc51fx/-24 53 12 tclcl b 30 ns 8xc51fx-33 5 tclcl b 25 ns tlliv ale low to valid instr in 8xc51fx 234 4tclcl b 100 ns 8xc51fx-24 91 4tclcl b 75 ns 8xc51fx-33 56 4tclcl b 65 ns tllpl ale low to psen low 8xc51fx/-24 53 12 tclcl b 30 ns 8xc51fx-33 5 tclcl b 25 ns tplph psen pulse width 205 80 46 3tclcl b 45 tpliv psen low to valid instr in 8xc51fx 145 3tclcl b 105 ns 8xc51fx-24 35 3tclcl b 90 ns 8xc51fx-33 35 3tclcl b 55 ns tpxix input instr hold after psen 000 0 ns 11
8xc51fx external memory characteristics (continued) all parameter values apply to all devices unless otherwise indicated symbol parameter oscillator units 12 mhz 24 mhz 33 mhz variable min max min max min max min max tpxiz input instr float after psen 8xc51fx 59 tclcl-25 ns 8xc51fx-24 21 tclcl-20 ns 8xc51fx-33 5 tclcl-25 ns taviv address to valid instr in 8xc51fx/-24 312 103 5tclcl b 105 ns 8xc51fx-33 71 5tclcl b 80 ns tplaz psen low to address float 10 10 10 10 ns trlrh rd pulse width 400 150 82 6tclcl b 100 ns twlwh wr pulse width 400 150 82 6tclcl b 100 ns trldv rd low to valid data in 8xc51fx 252 5tclcl b 165 ns 8xc51fx-24 113 5tclcl b 95 ns 8xc51fx-33 61 5tclcl b 90 ns trhdx data hold after rd 000 0 ns trhdz data float after rd 8xc51fx/24 107 23 2tclcl b 60 ns 8xc51fx-33 35 2tclcl b 25 ns tlldv ale low to valid data in 8xc51fx 517 8tclcl b 150 ns 8xc51fx-24/33 243 150 8tclcl b 90 ns tavdv address to valid data in 8xc51fx 585 9tclcl b 165 ns 8xc51fx-24/33 285 180 9tclcl b 90 ns tllwl ale low to rd or wr low 200 300 75 175 41 140 3tclcl b 50 3tclcl a 50 ns tavwl address to rd or wr low 8xc51fx 203 4tclcl b 130 ns 8xc51fx-24 77 4tclcl b 90 ns 8xc51fx-33 46 4tclcl b 75 ns tqvwx data valid to wr transition 8xc51fx 33 tclcl b 50 ns 8xc51fx-24/33 12 0 tclcl b 30 ns twhqx data hold after wr 8xc51fx 33 tclcl b 50 ns 8xc51fx-24 7 tclcl b 35 ns 8xc51fx-33 3 tclcl b 27 ns tqvwh data valid to wr high 8xc51fx 433 7tclcl b 150 ns 8xc51fx-24/33 222 142 7tclcl b 70 ns trlaz rd low to address float 0 0 0 0 ns twhlh rd or wr high to ale high 8xc51fx 43 123 tclcl b 40 tclcl a 40 ns 8xc51fx-24 12 71 tclcl b 30 tclcl a 30 ns 8xc51fx-33 5 55 tclcl b 25 tclcl a 25 ns 12
8xc51fx external program memory read cycle 272322 9 external data memory read cycle 272322 10 external data memory write cycle 272322 11 13
8xc51fx serial port timingeshift register mode test conditions: over operating conditions; load capacitance e 80 pf symbol parameter oscillator units 12 mhz 24 mhz 33 mhz variable min max min max min max min max txlxl serial port 1 0.50 0.36 12tclcl m s clock cycle time tqvxh output data 700 284 167 10tclcl b 133 ns setup to clock rising edge txhqx output data hold after clock rising edge 8xc51fx 50 2tclcl b 117 ns 8xc51fx-24/33 34 10 2tclcl b 50 ns txhdx input data hold 0 0 0 0 ns after clock rising edge txhdv clock rising 700 283 167 10tclcl b 133 ns edge to input data valid shift register mode timing waveforms 272322 12 14
8xc51fx external clock drive symbol parameter min max units 1/tclcl oscillator frequency mhz 8xc51fx 3.5 12 mhz 8xc51fx-1 3.5 16 mhz 8xc51fx-2 0.5 12 mhz 8xc51fx-24 3.5 24 mhz 8xc51fx-33 3.5 33 mhz tchcx high time 20 ns 8xc51fx-24/33 0.35 t osc 0.65 t osc ns tclcx low time 20 ns 8xc51fx-24/33 0.35 t osc 0.65 t osc ns tclch rise time 20 ns 8xc51fx-24 10 ns 8xc51fx-33 5 ns tchcl fall time 20 ns 8xc51fx-24 10 ns 8xc51fx-33 5 ns external clock drive waveform 272322 13 ac testing input, output waveforms 272322 14 ac inputs during testing are driven at v cc b 0.5v for a logic ``1'' and 0.45v for a logic ``0''. timing measurements are made at v ih min for a logic ``1'' and v ol max for a logic ``0''. float waveforms 272322 15 for timing purposes a port pin is no longer floating when a 100 mv change from load voltage occurs, and begins to float when a 100 mv change from the loaded v oh /v ol level occurs. i ol /i oh e g 20 ma. 15
8xc51fx programming the eprom/otp to be programmed, the part must be running with a 4 to 6 mhz oscillator. (the reason the oscillator needs to be running is that the internal bus is being used to transfer address and program data to appro- priate internal eprom locations.) the address of an eprom location to be programmed is applied to port 1 and pins p2.0 - p2.4 of port 2, while the code byte to be programmed into that location is applied to port 0. the other port 2 and 3 pins, rst psen , and ea /v pp should be held at the ``program'' levels indicated in table 4. ale/prog is pulsed low to program the code byte into the addressed eprom location. the setup is shown in figure 10. normally ea /v pp is held at logic high until just be- fore ale/prog is to be pulsed. then ea /v pp is raised to v pp , ale/prog is pulsed low, and then ea /v pp is returned to a valid high voltage. the volt- age on the ea /v pp pin must be at the valid ea /v pp high level before a verify is attempted. waveforms and detailed timing specifications are shown in later sections of this data sheet. note: # ea /v pp pin must not be allowed to go above the maximum specified v pp level for any amount of time. even a narrow glitch above that voltage lev- el can cause permanent damage to the device. the v pp source should be well regulated and free of glitches. table 4. eprom programming modes mode rst psen ale/ ea / p2.6 p2.7 p3.3 p3.6 p3.7 prog v pp program code data h l ? 12.75v l h h h h verify code data h l h h l l l h h program encryption h l ? 12.75v l h h l h array address 0 3fh program lock bit 1 h l ? 12.75v h h h h h bits bit 2 h l ? 12.75v h h h l l bit 3 h l ? 12.75v h l h h l read signature byte h l h h l l l l l 272322 20 * see table 4 for proper input on these pins figure 10. programming the eprom 16
8xc51fx programming algorithm refer to table 4 and figures 10 and 11 for address, data, and control signals set up. to program the 87c51fx the following sequence must be exercised. 1. input the valid address on the address lines. 2. input the appropriate data byte on the data lines. 3. activate the correct combination of control sig- nals. 4. raise ea /v pp from v cc to 12.75v g 0.25v. 5. pulse, ale/prog 5 times for the eprom ar- ray, and 25 times for the encryption table and the lock bits. repeat 1 through 5 changing the address and data for the entire array or until the end of the object file is reached. program verify program verify may be done after each byte or block of bytes is programmed. in either case a complete verify of the programmed array will ensure reliable programming of the 87c51fx. the lock bits cannot be directly verified. verification of the lock bits is done by observing that their fea- tures are enabled. 272322 21 figure 11. programming signals waveforms rom and eprom lock system the 87c51fx program lock system, when pro- grammed, protects the onboard program against software piracy. the 83c51fx has a one-level program lock system and a 64-byte encryption table. see line 2 of table 5. if program protection is desired, the user submits the encryption table with their code, and both the lock-bit and encryption array are programmed by the factory. the encryption array is not available without the lock bit. for the lock bit to be programmed, the user must submit an encryption table. the 83c51fa does not have protection features. the 87c51fx has a 3-level program lock system and a 64-byte encryption array. since this is an eprom device, all locations are user-programma- ble. see table 5. table 5. program lock bits and the features program lock bits protection type lb1 lb2 lb3 1 u u u no program lock features enabled. (code verify will still be encrypted by the encryption array if programmed.) 2 p u u movc instructions executed from external program memory are disabled from fetching code bytes from internal memory, ea is sampled and latched on reset, and further programming of the eprom is disabled. 3 p p u same as 2, also verify is disabled. 4 p p p same as 3, also external execution is disabled. any other combination of the lock bits is not defined. 17
8xc51fx encryption array within the eprom array are 64 bytes of encryption array that are initially unprogrammed (all 1's). every time that a byte is addressed during a verify, 6 ad- dress lines are used to select a byte of the encryp- tion array. this byte is then exclusive-nor'ed (xnor) with the code byte, creating an encryption verify byte. the algorithm, with the array in the un- programmed state (all 1's), will return the code in its original, unmodified form. for programming the en- cryption array, refer to table 4 (programming the eprom). when using the encryption array, one important fac- tor needs to be considered. if a code byte has the value 0ffh, verifying the byte will produce the en- cryption byte value. lf a large block ( l 64 bytes) of code is left unprogrammed, a verification routine will display the contents of the encryption array. for this reason all unused code bytes should be pro- grammed with some value other than 0ffh, and not all of them the same value. this will ensure maxi- mum program protection. program lock bits the 87c51fx has 3 programmable lock bits that when programmed according to table 5 will provide different levels of protection for the on-chip code and data. erasing the eprom also erases the encryption ar- ray and the program lock bits, returning the part to full functionality. reading the signature bytes the 87c51fx has 3 signature bytes in locations 30h, 31h, and 60h. the 83c51fa has 2 signature bytes in locations 30h and 31h. to read these bytes follow the procedure for eprom verify, but activate the control lines provided in table 4 for read signa- ture byte. location device contents 30h all 89h 31h all 58h 60h 83c51fa 7ah/fah 87c51fa fah 83c51fb 7bh/fbh 87c51fb fbh 83c51fc 7ch/fch 87c51fc fch erasure characteristics (windowed packages only) erasure of the eprom begins to occur when the chip is exposed to light with wavelength shorter than approximately 4,000 angstroms. since sunlight and fluorescent lighting have wavelengths in this range, exposure to these light sources over an extended time (about 1 week in sunlight, or 3 years in room- level fluorescent lighting) could cause inadvertent erasure. if an application subjects the device to this type of exposure, it is suggested that an opaque la- bel be placed over the window. the recommended erasure procedure is exposure to ultraviolet light (at 2537 angstroms) to an integrat- ed dose of at least 15 w-sec/cm. exposing the eprom to an ultraviolet lamp of 12,000 m w/cm rat- ing for 30 minutes, at a distance of about 1 inch, should be sufficient. erasure leaves all the eprom cells in a 1's state. 18
8xc51fx eprom programming and verification characteristics (t a e 21 cto27 c; v cc e 5v g 20%; v ss e 0v) symbol parameter min max units v pp programming supply voltage 12.5 13.0 v i pp programming supply current 75 ma 1/tclcl oscillator frequency 4 6 mhz tavgl address setup to prog low 48tclcl tghax address hold after prog 48tclcl tdvgl data setup to prog low 48tclcl tghdx data hold after prog 48tclcl tehsh p2.7 (enable) high to v pp 48tclcl tshgl v pp setup to prog low 10 m s tghsl v pp hold after prog 10 m s tglgh prog width 90 110 m s tavqv address to data valid 48tclcl telqv enable low to data valid 48tclcl tehqz data float after enable 0 48tclcl tghgl prog high to prog low 10 m s eprom programming and verification waveforms 272322 18 note: * 5 pulses for the eprom array, 25 pulses for the encryption table and lock bits. 19
8xc51fx thermal impedance all thermal impedance data is approximate for static air conditions at 1w of power dissipation. values will change depending on operating conditions and ap- plications. see the intel packaging handbook (order no. 240800) for a description of intel's thermal im- pedance test methodology. package i ja i jc device p45 c/w 16 c/w all d36 c/w 13 c/w 80C51FA, 83c51fa, 8xc51fc 45 c/w 15 c/w 87c51fa, 8xc51fb n46 c/w 16 c/w all s97 c/w 24 c/w fa 96 c/w 24 c/w fb 87 c/w 18 c/w fc data sheet revision history data sheets are changed as new device information becomes available. verify with your local intel sales office that you have the latest version before finalizing a design or ordering devices. the following differences exist between this datasheet (272322-003) and the previous version (272322-002): 1. removed 8xc51fx-3 and 8xc51fx-20, replaced with 8xc51fx-24. 2. included 8xc51fx-24 and 8xc51fx-33 devices. 3. 80C51FA and 83c51fa now have the same features as 87c51fa, 8xc51fb and 8xc51fc; same dc spec used for all devices. the following differences exist between the ``-002'' and ``-001'' version of 8xc51fx datasheet: 1. removed 8xc51fx-l from datasheet. 2. include v oh1 for 83c51fa (express)/80C51FA (express). this 8xc51fx datasheet (272322-001) replaces the following datasheets: 87c51fa/83c51fa/80C51FA 270258-007 83c51fa/80C51FA express 270620-001 87c51fa express 270619-001 87c51fa-20/-3 272081-002 87c51fb/83c51fb 270563-005 87c51fb-20/-3 83c51fb-20/-3 272080-002 87c51fb/83c51fb express 270767-002 87c51fc/83c51fc 270789-004 87c51fc/83c51fc express 270903-001 87c51fc-20/-3 83c51fc-20/-3 272028-002 20

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